Microstructure Evolution of Allotropic Materials during Thermomechanical Processing
نویسندگان
چکیده
منابع مشابه
Microstructure Evolution during Electric Current Induced Thermomechanical Fatigue of Interconnects
We demonstrate the evolution of microstructure and deformation associated with the use of electrical methods for evaluating mechanical reliability of patterned interconnects on rigid substrates. Thermomechanical fatigue in aluminum and copper interconnects was induced by means of low frequency (100 Hz), high density (> 10 MA/cm) alternating currents, which caused cyclic Joule heating and associ...
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ژورنال
عنوان ژورنال: Materials Science Forum
سال: 2012
ISSN: 1662-9752
DOI: 10.4028/www.scientific.net/msf.710.93